Optical Interconnects Conference

5 - 8 May 2013

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Final Program is now available

Call for Papers-Special Issue: Optical Interconnects (Nov/Dec 2013 JLT issue) Submission Deadline: 1 July 2013

Please join us for the Working Group Problem Session-Disaster Evacuation

Exhibitors

 

Want to exhibit at the Optical Interconnects Conference 2013?

Exhibit Hours:
6-8 May 2013-9:00am-4:00pm

Exhibitors

CEA-LETI

CEA-Leti is a research institute focused on micro and nanotechnologies and their applications. Silicon Photonics at Leti benefits from more than ten years of development of components prototyped on 200mm/300mm SOI wafers. We offer shuttle runs on standard components as well as custom runs. Our capabilities include 3D Stacking and Fiber to PICs packaging.

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FIBERPRO USA

FIBERPRO is an Opto-Mechanical Automatic System specialist who supplies the most efficient and reliable solution with its unique technologies, including Optical Interconnector Alignment & Testing system, Laser welding system, Alignment/Bonding system, etc.

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Fiber Optic Center

Fiber Optic Center is a provider of hybrid organic-inorganic polymer compositions capable of forming hard durable coatings suitable for waveguiding applications.  These materials are photoimageable, have low optical absorption, strong adhesion to many subtrates, can be tailored to a degree.

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Information Gatekeepers, Inc.

Information Gatekeepers, Inc. is a publisher, trade show organizer, consultancy and information service provider in the fields of fiber optics, high-speed Internet, wireless, and emerging telecom markets.  For more information, visit www.igigroup.com.

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ITW Chemtronics

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SHF North America, Inc.

SHF NA (direct sales subsidiary of SHF Communications Tech. AG) provides the fastest and most advanced Bit Error measurement systems,  optical communication modules, amplifiers, a digital modules currently available from any world wide vendor.

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nanoPrecision Products, Inc.

nanoPrecision Products is the world leader in complex material forming with nanometer tolerances.  nPP's products are based on proprietary nanoBench™ platform technology that has revolutionized the method for holding and aligning electrical, optical, mechanical or fluidic devices like integrated circuits, optical fibers, labs on chip, light detectors, laser, sensors and switches.

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OpSIS Center, University of Delaware

OpSIS (Optoelectronic Systems Integration in Silicon) - Multi-Project Wafer foundry service enables users to share wafer fabrication costs to build silicon photonics chips.  OpSIS hosts design software, Process Design Kits with photonic devices & IME foundry access.  OpSIS trained >100 students in 5-day design workshops at  >60 companies.   www.OpSISFoundry.org

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Ultra Communications Inc.

Ultra Comm will be highlighting the new 50GBPS X-80 transceiver platform along with single channel 28 Gbps transmit, receive and tranceiver products for high speed computing market.  The Ultra Comm platforms are specifically designed for extreme temperature and ruggedized environments well in excess of commercial capabilities.

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US Conec Ltd.

US Conec manufactures and markets MT-style and contract multi-fiber ferrules, the MTP® connector family, PRIZM® LightTurn® lensed ferrule technology, fiber management products, dry cleaning solutions, and high precision molded and metal components for parallel optic transceiver interfaces.

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Conference Contact

Want to exhibit at the conference?

Please contact us for more information or to discuss other opportunities:

Megan Figueroa

Conference Planner

Phone + 1 732 562 3895

m.figueroa@ieee.org

Membership

Not an IEEE Photonics Society member yet?

Join now

Conference Planner

Megan Figueroa

Conference Planner

Phone + 1 732 562 3895

Fax + 1 732 562 8434

m.figueroa@ieee.org

IEEE Photonics Society

445 Hoes Lane

Piscataway, NJ 08855-1331 USA

www.photonicssociety.org